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Why Are Ceramic Fillers More Suitable for Thermal Interface Materials?

Oct 23, 2025

Thermal interface materials are filled between heating components and heat sinks, requiring both high thermal conductivity and good electrical insulation. The thermal conductivity of a material is closely related to the motion of its microscopic particles. Heat conduction primarily occurs through three mechanisms: electron conduction, photon conduction, and phonon conduction. Metallic materials primarily rely on free electrons for heat conduction. Photonic thermal conduction mainly applies to transparent glass materials. Polymer and ceramic materials primarily conduct heat through phonons. However, the random entanglement of polymer molecular chains, the polydispersity of molecular weight, and the scattering of phonons by molecular chain vibrations result in very low intrinsic thermal conductivity.

 

Therefore, in polymer/ceramic composites, heat conduction primarily relies on the ceramic fillers as the carrier. The interaction between atoms within their crystal structure can be simply described as a mass-spring system. This allows atoms to vibrate around their minimum potential energy, generating lattice waves that enable phonon conduction, which can transfer heat more effectively.

 

To achieve high thermal conductivity, the ceramic fillers within the thermal interface material must contact and pile up against each other, forming a continuous network throughout the polymer matrix. The majority of heat is transferred through this network, significantly enhancing the thermal conductivity of the polymer composite.

 

However, an excessively high filler loading leads to agglomeration of the filler particles, creating voids between them. The extremely low thermal conductivity of air (only 0.0257 W·m⁻¹·K⁻¹) leads to a decrease in the system's overall thermal conductivity. Furthermore, issues such as poor matrix flowability, unstable performance, and susceptibility to separation can arise during application.

 

About Xiamen Juci Technology Co., LTD

The aluminum nitride filler from Xiamen Juci Technology Co., Ltd. is engineered to provide high thermal conductivity and electrical insulation, thereby significantly improving heat dissipation in resin or plastic composites. Its superior performance extends beyond thermal management, featuring industry-leading anti-hydrolysis and anti-aging properties for enhanced durability.

 

Contact us:
Xiamen Juci Technology Co., Ltd.

Phone: +86 592 7080230
Email: miki_huang@chinajuci.com

Website: www.jucialnglobal.com

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