With the vigorous development of microelectronics and semiconductor technology, motors and electronic components have gradually entered an era of miniaturization, light weight, high energy density and high power output. The heat flux density of electronic substrates has increased significantly, and...
In semiconductor manufacturing, heat dissipation of silicon wafers is critical. Failure to maintain uniform temperature across the silicon wafer surface will compromise processing uniformity and precision during wafer fabrication.
The advantages of using aluminum nitride as the primar...
